News
Site Editor
Site
/uploads/image/647ec80aa8ffa.png
Fodenn is excited to announce its participation in the Hong Kong Global Sources Exhibitions in October 2024, where we will showcase our latest industrial motherboard and industrial computing solutions. Our exhibit will feature the Mini PC-F20 with AMD Ryzen 7 Series CPU and versatile USB ports, the Mini PC-F30 with Intel Alder Lake N Series CPUs and three HDMI interfaces, the IPC-AC600 embedded industrial PC with an Intel Elkhart Lake J6412 CPU, the fanless IPC-AC700 with an Intel Core 11th Gen Tiger Lake CPU, and the IPC-H61010C Mini ITX motherboard with support for 4G/5G and Wi-Fi. These products demonstrate our commitment to innovation, performance, and connectivity. We invite you to visit our booth 7P34 to explore how Fodenn's technology can enhance your operations and look forward to engaging with you at the event.
Invitation:Fodenn Prepares Groundbreaking Products for HK Global Sources Expo
Views: 878
Author: Site Editor
Publish Time: 2024-10-14
Origin: Site
Fodenn is excited to announce our participation in the upcoming Hong Kong Global Sources Mobile Electronic Exhibitions, a series of trade shows that bring together the latest in mobile electronics, smart home solutions, lifestyle products, and home & kitchen essentials. These exhibitions, to be held on Oct 18 - 21, 2024 at AsiaWorld-Expo, Hong Kong, are a hub for industry professionals, innovators, and buyers looking to explore the cutting edge of technology and design.
The Global Sources Exhibitions are renowned for their comprehensive display of the latest industry trends and advancements. This October, we will witness four concurrent events: Global Sources Mobile Electronics, Global Sources Smart Home, Security & Appliances, Global Sources Lifestyle and Global Sources Home & Kitchen.
Visit Fodenn at the Expo
We are proud to be a part of these prestigious events as a supplier of industrial motherboards, industrial PCs, and mini PCs. Fodenn is committed to delivering robust, reliable, and innovative solutions that power the future of industrial automation and smart manufacturing.
We cordially invite you to visit our booth at the Hong Kong AsiaWorld-Expo. Here are the details:
-
Date: October 18-21, 2024
-
Location: Hong Kong AsiaWorld-Expo
-
Booth Number: 7P34
At our booth, we will be showcasing not only our existing lineup of industrial motherboards and embedded computer products but also some exciting new additions to our portfolio.
Fodenn's Upcoming Showcase: A Glimpse into Innovation
1. Mini PC-F20: Power and Connectivity in a Small Form Factor Motherboard
-
Equipped with an AMD Ryzen 7 Series CPU, the Mini PC-F20 offers high-performance processing for demanding tasks.
-
Features an array of USB ports including 1 Thunderbolt, 1 Type-C, 2 USB 3.2, and 2 USB 2.0 for versatile connectivity.
-
Supports dual display with DP and HDMI outputs, ideal for multi-monitor setups.
-
Includes 2 LAN interfaces and 1 Audio interface for comprehensive network and audio capabilities.
2. Mini PC-F30: Versatility with Intel Alder Lake N Series CPUs
-
Powered by Intel Alder Lake N Series N95 N100 N300 CPUs, providing robust performance.
-
Offers 3 USB 3.0 ports and 1 Type-C port for convenient connectivity.
-
Boasts 3 HDMI display interfaces for extensive visual capabilities.
-
Features 2 LAN ports and 1 Audio interface for reliable networking and audio output.
3. Industrial PC IPC-AC600: Robust and Expandable Computer
-
Houses an Intel Elkhart Lake J6412 CPU in a compact embedded industrial PC.
-
Supports up to 32GB of DDR4 memory and has 2 LAN ports.
-
Offers an impressive 10 USB ports for extensive peripheral support.
-
Supports VGA and HDMI displays and includes a PCIE slot on the small form factor ITX motherboard.
4. Industrial PC IPC-AC700: Fanless Design with Advanced Performance
-
Features a fanless design powered by an Intel Core 11th Gen Tiger Lake CPU.
-
Supports up to 32GB of DDR4 memory and includes 2 LAN ports.
-
Offers 10 USB ports and supports DP and HDMI displays.
-
Compatible with Windows 10/11, Linux, and Unix operating systems.
5. Industrial Motherboard IPC-H61010C: Future-Proof and Connected
-
A Mini ITX motherboard with an Intel Core 12th Gen Socket LGA1700 CPU and an H610 chipset.
-
Supports 2 SO-DIMM DDR4 memory slots for up to 64GB of RAM.
-
Features M.2 B and M.2 E slots with support for 4G/5G and Wi-Fi, ensuring connectivity for modern applications.
Visit us at the exhibition to see these products in action and learn how they can drive efficiency and innovation in your projects. Fodenn is committed to delivering the latest in industrial computing solutions, and we look forward to sharing our expertise with you.
Looking Forward to Engaging with You
We are looking forward to meeting with you at the exhibition to discuss how our products can support your business objectives. It will be a great opportunity to exchange ideas, explore partnerships, and learn about the latest industry developments.
Please feel free to reach out to us at doris@fodenn.com for any inquiries or to schedule a meeting at our booth.