Invitation:Fodenn Prepares Groundbreaking Products for HK Global Sources Expo
Fodenn is excited to announce its participation in the Hong Kong Global Sources Exhibitions in October 2024, where we will showcase our latest industrial motherboard and industrial computing solutions. Our exhibit will feature the Mini PC-F20 with AMD Ryzen 7 Series CPU and versatile USB ports, the Mini PC-F30 with Intel Alder Lake N Series CPUs and three HDMI interfaces, the IPC-AC600 embedded industrial PC with an Intel Elkhart Lake J6412 CPU, the fanless IPC-AC700 with an Intel Core 11th Gen Tiger Lake CPU, and the IPC-H61010C Mini ITX motherboard with support for 4G/5G and Wi-Fi. These products demonstrate our commitment to innovation, performance, and connectivity. We invite you to visit our booth 7P34 to explore how Fodenn's technology can enhance your operations and look forward to engaging with you at the event.