Following four days of productive demonstrations and engaging exchanges in the Hong Kong Expo, Fodenn closed its successful participation in the Hong Kong Global Sources Exhibitions, held at the Hong Kong AsiaWorld-Expo in October 2024. The event served as a platform for Fodenn to unveil its latest industrial motherboard and embedded computing innovations to a global audience. It also was a link for industry leaders to connect and explore innovative solutions in mini PCs and industrial computing.
A Showcase of Groundbreaking Products
Fodenn's booth was a hub of activity as we presented our new line of motherboards, embedded computers and mini PCs, including the Mini PC -F20, Mini PC -F30, Industrial embedded PC -AC600, and the Industrial Mini ITX Motherboard IPC-H61010C. These products attracted a significant amount of attention due to their advanced features and potential applications in various industries.
The Mini PC -F20, with its AMD Ryzen7 Series CPU and extensive USB connectivity, was particularly admired for its performance in a compact small form factor board. The Mini PC -F30, featuring Intel Alder Lake N Series(N95 N100 N300) CPUs, impressed with its triple HDMI interfaces and robust processing capabilities.
Our Industrial embedded fanless computer, the IPC-AC600, showcased the versatility and reliability of Fodenn's offerings. The IPC-AC600, with its Intel Elkhart Lake J6412 CPU, up to 32GB DDR4 memory and the fanless design, demonstrated our commitment to meeting diverse industrial application needs.
The Industrial Mini ITX Motherboard IPC-H61010C, supporting Intel Core 12th Gen Socket LGA1700 CPUs, H610 Chipset and featuring M.2 slots for 4G/5G and Wi-Fi, was a testament to Fodenn's focus on future-proofing our products for the evolving technological landscape.
Global Interest and Networking
The exhibition was an opportunity for Fodenn manufacturer to not only display our industrial products but also to engage with a diverse group of domestic and international clients. We had the pleasure of welcoming visitors from various sectors, including industrial automated manufacturing, technology, financial, medical, security, network, kiosk, robot, and retail, who showed keen interest in our offerings. Fodenn's booth welcomed a stream of attendees who were eager to learn about our products, engage in technical discussions, and explore partnership opportunities.
The interactions at our booth were insightful, with discussions ranging from product specifications to potential collaborations. The enthusiasm and feedback from clients were overwhelmingly positive, providing valuable insights that will guide our future product developments.
Looking Forward to Future Opportunities
As we reflect on the success of our participation in the Hong Kong Global Sources Exhibitions, Fodenn is grateful for the opportunity to connect with industry professionals and customers from around the world. The event has reinforced our position as a leader in industrial computing solutions and has opened doors to new partnerships and markets.
We would like to extend our sincere thanks to all the visitors, partners, and organizers for making this exhibition a memorable experience. For those who missed the event, we invite you to visit our website or contact us directly to learn more about our showcased products and how they can drive efficiency and innovation in your projects. We are already looking forward to our next engagement, where we can continue to share our innovations and contribute to the advancement of industrial automation and smart manufacturing globally.
Fodenn remains committed to delivering cutting-edge industrial computing solutions and looks forward to continued growth and engagement within the global technology community. For more information about Fodenn and our products, please contact us directly.
We thank you for your support and interest, and we eagerly anticipate our paths crossing again in future industry events.
