On July 24, 2024, a much-anticipated technological event took place — the 17th Intel NEX Summit. This conference saw over 400 industry elites gather to explore and showcase the latest advancements and application cases of AI in the field of edge computing. As a professional industrial PC and industrial motherboard manufacturer, Fodenn was honored with the "Best Potential Award" by Intel at this conference. This accolade is not only a recognition of Fodenn's technical strength and market potential but also an affirmation of its commitment to providing high-quality industrial hardware and its spirit of innovation within the industry.
The industrial motherboard and industrial PC industry, as the core support of intelligent manufacturing, is entering a golden period of rapid development. With the advancement of Industry 4.0 and intelligent manufacturing, the demand for high-performance, highly reliable industrial computing platforms is increasingly growing. The integration of AI technology has brought new growth points to the industry, and Fodenn is achieving digital transformation through AI, promoting high-quality development of the industry.
Since its establishment in 2009, Fodenn has been focused on the design and manufacturing of advanced industrial motherboards and embedded computing platforms. The manufacturer is dedicated to providing innovative engineering and Industry 4.0 solutions, with its products widely applied in industrial automation, cutting-edge AI hardware, and IoT solution platforms. Fodenn's award signifies the industry's broad recognition of its outstanding performance and innovative capabilities in fields such as industrial automation, rail transit, financial terminals, and medical social security. As a member of the Intel IoT Solutions Alliance, Fodenn leverages its expertise in high-performance computing technology to provide customers with a variety of solutions, rapidly responding to one-stop customization demands for industrial motherboards, industrial PC and other products, demonstrating strong market competitiveness and industry influence.
Looking ahead, Fodenn will continue to join hands with partners such as Intel to continuously promote technological innovation to meet the needs of customers in different industry sectors. We believe that through continuous efforts and cooperation, Fodenn will be able to provide global customers with higher quality and more reliable industrial motherboard and industrial PC solutions. With the extensive application of AI and edge technology, Fodenn is expected to achieve broader applications in various fields such as intelligent manufacturing, IOT smart cities, and intelligent security, together embarking on a new chapter of the AI+ era.
